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Magnetron Sputtering Line
Product features
Technical Parameters | |
|---|---|
| Equipment Model | ZCJ-300（600、1200） |
| Ultimate Vacuum | 8×10-5Pa |
| Functional Classification of Chambers | Sample inlet and outlet chambers(1000 Pa) |
| Transition chamber(0.5Pa) | |
| Buffer chamber(pressure and atmosphere matched sputter chamber) | |
| ttering chamber(0.5Pa) | |
| Sputtering Target Type | Rectangular plane target,cylindrical rotating target |
Technical Parameters | |
|---|---|
| Sample width | 300、600、1200mm |
| Commonly Used Target Materials | ITO、NiO2、Cu |
| Target Distance | 80~120mm |
| Coating Beat | ≥60s |
| Continuous Running Time | ≥200h |
| Film Thickness Uniformity Within the Film | ≤±3% |
| Film Thickness Uniformity between Sheets | ≤±3% |
